The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Apr. 19, 2011
Applicants:

Krishna Nadella, Seattle, WA (US);

Xiaoxi Wang, Mukilteo, WA (US);

Vipin Kumar, Seattle, WA (US);

Inventors:

Krishna Nadella, Seattle, WA (US);

Xiaoxi Wang, Mukilteo, WA (US);

Vipin Kumar, Seattle, WA (US);

Assignees:

Dart Container Corporation, Mason, MI (US);

University of Washington, Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B32B 37/04 (2006.01); B29C 44/06 (2006.01); B29C 65/20 (2006.01); B29C 65/00 (2006.01); B32B 27/06 (2006.01); B32B 37/20 (2006.01); B32B 38/00 (2006.01); B29K 105/04 (2006.01); B29C 65/10 (2006.01); B29C 65/14 (2006.01); B29C 65/30 (2006.01); B29C 65/82 (2006.01); B32B 37/12 (2006.01); B29L 31/00 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
B32B 37/04 (2013.01); B29C 44/06 (2013.01); B29C 65/203 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/727 (2013.01); B29C 66/73921 (2013.01); B29C 66/8264 (2013.01); B29C 66/83413 (2013.01); B29C 66/9292 (2013.01); B32B 27/065 (2013.01); B29C 65/10 (2013.01); B29C 65/1412 (2013.01); B29C 65/30 (2013.01); B29C 65/483 (2013.01); B29C 65/8253 (2013.01); B29C 66/71 (2013.01); B29K 2105/041 (2013.01); B29K 2105/043 (2013.01); B29K 2105/046 (2013.01); B29L 2031/776 (2013.01); B32B 37/12 (2013.01); B32B 37/203 (2013.01); B32B 2038/0084 (2013.01); B32B 2250/22 (2013.01); B32B 2266/08 (2013.01); B32B 2305/022 (2013.01); B32B 2309/04 (2013.01); B32B 2309/105 (2013.01); B32B 2309/12 (2013.01); B32B 2367/00 (2013.01); B32B 2607/00 (2013.01); Y10T 156/10 (2015.01);
Abstract

A method for joining two components includes positioning a thermoplastic polymer portion of a first component adjacent a thermoplastic polymer portion of a second component such that the first and second portions form an interface. At least one of the portions includes a microstructure having a plurality of closed cells, each cell containing a void and each cell having a maximum dimension extending across the void. The method also includes exerting pressure on the thermoplastic polymer portions to form a bond at the interface that holds the portions together. The plurality of closed cells, and especially those adjacent the surface of the thermoplastic polymer portion that form the interface, help isolate thermally and/or chemically the surface from the remainder of the portion.


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