The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Nov. 28, 2012
Applicants:

David Eugene Baker, Bath, NY (US);

Carme Gomez Carbonell, Barcelona, ES;

David Francis Dawson-elli, Elmira, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Valerio Pruneri, Castelldefels, ES;

Lili Tian, Laurel, MD (US);

Inventors:

David Eugene Baker, Bath, NY (US);

Carme Gomez Carbonell, Barcelona, ES;

David Francis Dawson-Elli, Elmira, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Valerio Pruneri, Castelldefels, ES;

Lili Tian, Laurel, MD (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 33/00 (2006.01); B05D 3/02 (2006.01); C23C 14/18 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
B32B 33/00 (2013.01); B05D 3/0254 (2013.01); C23C 14/185 (2013.01); C23C 14/5806 (2013.01); Y10T 428/24355 (2015.01);
Abstract

Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.


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