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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9296180 B1

PDFFull Text
Date of Patent:
Mar. 29, 2016

Filed:

Nov. 16, 2011

Metal foil for base material

Applicants:

Shinichi Terashima, Tokyo, JP;

Takayuki Kobayashi, Tokyo, JP;

Masamoto Tanaka, Tokyo, JP;

Masami Fujishima, Iruma, JP;

Masao Kurosaki, Tokyo, JP;

Jun Maki, Tokyo, JP;

Hideaki Suda, Tokyo, JP;

Shuji Nagasaki, Tokyo, JP;

Inventors:

Shinichi Terashima, Tokyo, JP;

Takayuki Kobayashi, Tokyo, JP;

Masamoto Tanaka, Tokyo, JP;

Masami Fujishima, Iruma, JP;

Masao Kurosaki, Tokyo, JP;

Jun Maki, Tokyo, JP;

Hideaki Suda, Tokyo, JP;

Shuji Nagasaki, Tokyo, JP;

Assignees:

NIPPON STELL & SUMIKIN MATERIALS CO., LTD., Tokyo, JP;

NIPPON STEEL & SUMITOMO METAL CORPORATION, Tokyo, JP;

Attorney:

Kenyon & Kenyon LLP

Primary Examiner:

Adam Krupicka

Int. Cl.
CPC ...
H01L 51/00 (2006.01); B32B 15/01 (2006.01); C23C 2/12 (2006.01); C23C 2/26 (2006.01); H01L 31/0392 (2006.01); H01L 31/02 (2006.01); C23C 2/02 (2006.01); C25D 3/04 (2006.01); C23C 8/24 (2006.01); C23C 14/14 (2006.01); C23C 18/12 (2006.01); C23C 28/00 (2006.01); C25D 5/12 (2006.01); C25D 5/48 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01); C23C 18/16 (2006.01); C23C 2/40 (2006.01); C23C 8/02 (2006.01); C25D 11/08 (2006.01);
U.S. Cl.
CPC ...
B32B 15/012 (2013.01); C23C 2/02 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/40 (2013.01); C23C 8/02 (2013.01); C23C 8/24 (2013.01); C23C 14/14 (2013.01); C23C 18/125 (2013.01); C23C 18/1651 (2013.01); C23C 28/321 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); C25D 3/04 (2013.01); C25D 5/12 (2013.01); C25D 5/48 (2013.01); C25D 5/50 (2013.01); C25D 7/0614 (2013.01); H01L 31/02 (2013.01); H01L 31/0392 (2013.01); H01L 31/03923 (2013.01); H01L 31/03925 (2013.01); C23C 18/1254 (2013.01); C25D 11/08 (2013.01); H01L 51/0096 (2013.01); Y02E 10/541 (2013.01); Y10T 428/12438 (2015.01);
Abstract

A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an AlCuFe intermetallic compound or FeAlbased intermetallic compounds.

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