The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Jun. 14, 2011
Hirofumi Murata, Hanishina-gun, JP;
Isamu Komamura, Hanishina-gun, JP;
Nobukazu Kasuga, Hanishina-gun, JP;
Takashi Hakoda, Hanishina-gun, JP;
Hitoshi Saitoh, Hanishina-gun, JP;
Hirofumi Murata, Hanishina-gun, JP;
Isamu Komamura, Hanishina-gun, JP;
Nobukazu Kasuga, Hanishina-gun, JP;
Takashi Hakoda, Hanishina-gun, JP;
Hitoshi Saitoh, Hanishina-gun, JP;
NISSEI PLASTIC INDUSTRIAL CO., LTD., Nagano, JP;
Abstract
In performing molding by injecting and filling a resin by an injecting device with a predetermined injection pressure into a mold formed of a fixed mold and a movable mold clamped by a clamping device with a predetermined clamping force, at least a clamping device which enables natural compression of the resin with solidification of the resin in the mold is used as the clamping device, a molding injection pressure and a molding clamping force with which a predetermined mold gap is generated between the movable mold and the fixed mold in injection and filling and a non-defective product can be molded are acquired and set in advance, the clamping device is clamped with the molding clamping force during production, the molding injection pressure is set as a limit pressure, and after the resin is injected and filled in the mold by driving the injecting device.