The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Sep. 24, 2014
Seiko Instruments Inc., Chiba-shi, Chiba, JP;
Yasuo Terui, Chiba, JP;
Masaru Akino, Chiba, JP;
SEIKO INSTRUMENTS INC., , JP;
Abstract
A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip. A lead frame on which the semiconductor chip is mounted is provided between an upper mold and a lower mold. A tapered positioning pin is provided to the lower mold and includes a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin. Ejector pins are disposed in proximity to the tapered positioning pin at a distance determined by a thickness of the lead frame. The ejector pins are arranged so as to be symmetrical with respect to the tapered positioning pin.