The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 12, 2011
Applicants:

S. Abbas Hosseini, Richmond Hill, CA;

Peter R. Herman, Toronto, CA;

Inventors:

S. Abbas Hosseini, Richmond Hill, CA;

Peter R. Herman, Toronto, CA;

Assignee:

ROFIN-SINAR TECHNOLOGIES INC., Plymouth, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/06 (2014.01); B26F 3/00 (2006.01); H01L 21/263 (2006.01); C03B 33/02 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0057 (2013.01); B23K 26/0006 (2013.01); B23K 26/0604 (2013.01); B23K 26/0619 (2015.10); B23K 26/0624 (2015.10); B26F 3/00 (2013.01); C03B 33/0222 (2013.01); H01L 21/2633 (2013.01); B23K 2203/50 (2015.10); Y10T 225/12 (2015.04);
Abstract

A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that includes pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving the substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves. The laser pulses may be delivered in a burst train for lowering the energy threshold for filament formation, increasing filament length, thermally annealing of the filament modification zone to minimize collateral damage, and increasing the processing speed compared with the use of low repetition rate lasers.


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