The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 08, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Daniel James Buschel, Poughkeepsie, NY (US);

Michael J Fisher, Poughkeepsie, NY (US);

James Edward Tersigni, Highland, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 37/00 (2006.01); B23K 3/08 (2006.01); B23K 1/00 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
B23K 3/085 (2013.01); B23K 1/0016 (2013.01); H05K 3/303 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/04 (2013.01);
Abstract

An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device.


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