The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Apr. 25, 2014
Applicants:

Todd Mathew Spath, Hilton, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Inventors:

Todd Mathew Spath, Hilton, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B05D 3/00 (2006.01); B05D 3/12 (2006.01); B05D 1/36 (2006.01); B05D 1/38 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H01B 13/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B05D 3/007 (2013.01); B05D 1/36 (2013.01); B05D 1/38 (2013.01); B05D 3/12 (2013.01); H05K 3/42 (2013.01); H05K 3/467 (2013.01); H05K 3/4644 (2013.01); H01B 13/00 (2013.01); H01L 21/76877 (2013.01); H01L 21/76883 (2013.01);
Abstract

A method of making a multi-layer micro-wire structure resistant to cracking on a substrate having a surface including forming a plurality of micro-channels in the substrate, locating a first electrically conductive material composition forming a first layer in each micro-channel, and locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel and in electrical contact with the first electrically conductive material composition thereby providing an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking.


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