The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Jan. 07, 2015
Applicant:

Otter Products, Llc, Fort Collins, CO (US);

Inventors:

Kevin W. Witter, Fort Collins, CO (US);

Matthew S. Krajec, Loveland, CO (US);

Patrick J. Nelson, Fort Collins, CO (US);

Paul N. Walker, Fort Collins, CO (US);

Thomas D. Boileau, Fort Collins, CO (US);

Assignee:

OTTER PRODUCTS, LLC, Fort Collins, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A45C 5/02 (2006.01); H05K 5/03 (2006.01); B65D 81/02 (2006.01); A45C 11/00 (2006.01); G06F 1/16 (2006.01); H04B 1/3888 (2015.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); A45C 5/02 (2013.01); A45C 11/00 (2013.01); B65D 81/022 (2013.01); G06F 1/1656 (2013.01); H04B 1/3888 (2013.01); A45C 2011/002 (2013.01); G06F 2200/1633 (2013.01);
Abstract

A protective enclosure for an electronic device includes a shell, a first cushioning layer and a second cushioning layer. The shell includes an inner and an outer surface, a retaining wall defined by a perimeter portion of the shell, the retaining wall having a top-side, a bottom-side, and left and right side wall portions. The first cushioning layer includes a front surface and a back surface, the back surface of the first cushioning layer being overmolded on the inner surface of the shell and the front surface cushioning the back portion of the electronic device. The second cushioning member includes a perimeter wall having a tope side wall, a bottom side wall, and left and right side walls, the perimeter wall being overmolded with the retaining wall of the bottom shell and adapted to form-fit over at least the perimeter portion of the electronic device.


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