The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Sep. 03, 2013
Samsung Display Co., Ltd., Yongin, KR;
An-Ho Jee, Yongin, KR;
Seok-Hoon Yoon, Yongin, KR;
Jong-Heon Han, Yongin, KR;
Young-Hoon Lee, Yongin, KR;
Samsung Display Co., Ltd., Yongin-si, KR;
Abstract
A method of bonding a flexible printed circuit board (FPCB). The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and heating and pressing the connection unit of the FPCB onto the connection unit of the panel. The thermally conductive sheet includes through holes that are formed in the thermally conductive sheet or grooves that are formed in a bottom surface of the thermally conductive sheet. In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet.