The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9295156 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 22, 2016

Filed:

May. 21, 2014
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Kouji Ichinose, Osaka, JP;

Jun Ishii, Osaka, JP;

Yoshito Fujimura, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/05 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 1/0271 (2013.01); H05K 1/05 (2013.01); H05K 3/0082 (2013.01); H05K 3/32 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/308 (2013.01);
Abstract

A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.


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