The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Sep. 27, 2013
Applicant:
Fujifilm Corporation, Minato-ku, Tokyo, JP;
Inventor:
Koichi Minami, Ashigara-kami-gun, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/44 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H01L 31/04 (2014.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H05K 3/389 (2013.01); H05K 3/44 (2013.01); H05K 3/4673 (2013.01); H05K 2203/122 (2013.01);
Abstract
The purpose of the present invention is to provide a printed circuit board wherein a resin layer exhibits excellent adhesion and a method for manufacturing said printed circuit board. This printed circuit board is provided with an insulating substrate, metal wiring laid out on said insulating substrate, and an insulating layer disposed on top of said metal wiring. A layer consisting of a thiol compound having at least four functional groups represented by formula (1) is interposed between the metal wiring and the insulating layer at the interface therebetween.