The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Mar. 01, 2013
Applicant:

Oledworks Gmbh, Aachen, DE;

Inventor:

Dirk Hente, Wuerselen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G09G 3/10 (2006.01); H05B 33/08 (2006.01); H01L 27/32 (2006.01); H05K 1/02 (2006.01); F21V 29/00 (2015.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05B 33/0896 (2013.01); F21V 29/246 (2013.01); H01L 27/3204 (2013.01); H05B 33/0821 (2013.01); H05K 1/0201 (2013.01); H01L 2251/5361 (2013.01); H05K 1/0209 (2013.01); H05K 1/182 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/062 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01);
Abstract

The invention relates to an electroluminescent lighting device, which is based on an array of standard electroluminescent tiles (D-D) combined with an array of ballast components (R-R) mounted on a carrier board () in such a way that the power loss is evenly spread across the whole board area to minimize local electric power in the ballast components. The unavoidable remaining hot spots and electroluminescent tiles are thermally coupled in such a way that the additional thermal load on the electroluminescent emission layer is as symmetric as possible with respect to the self heating of the electroluminescent device. This can be achieved by a combination of properly designed heat spreading and thermal isolation of the electroluminescent and ballast components. Heat spreading is achieved by a properly designed interconnection structure () on the carrier board. Different options are proposed to thermally isolate the electroluminescent tiles from the hot spots.


Find Patent Forward Citations

Loading…