The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Feb. 03, 2012
Applicants:

Dieter Haas, San Jose, CA (US);

John M. White, Hayward, CA (US);

Byung-sung Leo Kwak, Portland, OR (US);

Soo Young Choi, Fremont, CA (US);

Jrjyan Jerry Chen, Campbell, CA (US);

Jose Manuel Dieguez-campo, Hanau, DE;

Inventors:

Dieter Haas, San Jose, CA (US);

John M. White, Hayward, CA (US);

Byung-sung Leo Kwak, Portland, OR (US);

Soo Young Choi, Fremont, CA (US);

Jrjyan Jerry Chen, Campbell, CA (US);

Jose Manuel Dieguez-Campo, Hanau, DE;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0014 (2013.01); H01L 51/5253 (2013.01);
Abstract

Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.


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