The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Feb. 10, 2014
Nichia Corporation, Anan-shi, Tokushima, JP;
Citizen Electronics Co., Ltd., Fujiyoshida-shi, Yamanashi, JP;
Citizen Holdings Co., Ltd., Nishi-Tokyo-shi, Tokyo, JP;
Takeshi Kususe, Tokushima, JP;
Toshiaki Ogawa, Anan, JP;
Shunsuke Minato, Anan, JP;
Nodoka Oyamada, Fujiyoshida, JP;
NICHIA CORPORATION, Anan-shi, JP;
CITIZEN ELECTRONICS CO., LTD., Fujiyoshida-shi, JP;
CITIZEN HOLDINGS CO., LTD., Nishi-Tokyo-Shi, JP;
Abstract
A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.