The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

May. 17, 2013
Applicant:

Yuji Imai, Tokyo, JP;

Inventor:

Yuji Imai, Tokyo, JP;

Assignee:

DE L ASSOCIATES INC., Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 33/48 (2010.01); F21K 99/00 (2010.01); H01L 27/15 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); F21V 3/00 (2015.01); F21Y 101/02 (2006.01); F21Y 105/00 (2006.01); F21Y 113/00 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); F21K 9/135 (2013.01); H01L 27/15 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); F21V 3/00 (2013.01); F21Y 2101/02 (2013.01); F21Y 2105/003 (2013.01); F21Y 2113/005 (2013.01); H01L 25/0753 (2013.01); H01L 33/0079 (2013.01); H01L 2224/14 (2013.01); H01L 2224/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

[Problem] To provide a chip-on-board light emitting device and a method for manufacturing the same such that even though the light emitting device is a chip-on-board light emitting device, it is possible to improve color rendering thereof without excessively reducing the amount of light emission and without installing special circuit patterns or performing current control. [Solution] A chip-on-board light emitting device in which a plurality of LED elements are mounted directly on a package substrate includes a circuit pattern formed on the package substrate, the circuit pattern including a plurality of mounting sections on which the plurality of LED elements are mounted and an anode electrode and cathode electrode pair. The LED elements mounted on the circuit pattern include a plurality of types of LED elements having different emission wavelengths and temperature characteristics, so that by utilizing the temperature characteristics of the plurality of types of LED elements, the device as a whole has a greater average color rendering index (Ra) at an operating temperature than at a ordinary temperature.


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