The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
May. 03, 2010
Terry L. Smith, Roseville, MN (US);
Catherine A. Leatherdale, Woodbury, MN (US);
Michael A. Haase, St. Paul, MN (US);
Thomas J. Miller, Woodbury, MN (US);
Xiaoguang Sun, Woodbury, MN (US);
Zhaohui Yang, North Oaks, MN (US);
Todd A. Ballen, St. Paul, MN (US);
Amy S. Barnes, St. Paul, MN (US);
Terry L. Smith, Roseville, MN (US);
Catherine A. Leatherdale, Woodbury, MN (US);
Michael A. Haase, St. Paul, MN (US);
Thomas J. Miller, Woodbury, MN (US);
Xiaoguang Sun, Woodbury, MN (US);
Zhaohui Yang, North Oaks, MN (US);
Todd A. Ballen, St. Paul, MN (US);
Amy S. Barnes, St. Paul, MN (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
Re-emitting semiconductor constructions (RSCs) for use with LEDs, and related devices, systems, and methods are disclosed. A method of fabrication includes providing a semiconductor substrate, forming on a first side of the substrate a semiconductor layer stack, attaching a carrier window to the stack, and removing the substrate after the attaching step. The stack includes an active region adapted to convert light at a first wavelength λto visible light at a second wavelength λ, the active region including at least a first potential well. The attaching step is carried out such that the stack is disposed between the substrate and the carrier window, which is transparent to the second wavelength λ. The carrier window may also have a lateral dimension greater than that of the stack. The removal step is carried out so as to provide an RSC carrier device that includes the carrier window and the stack.