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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9293565 B1

PDFFull Text
Date of Patent:
Mar. 22, 2016

Filed:

Dec. 09, 2013

Etchant composition and method of manufacturing metal wiring and thin film transistor substrate using the etchant

Applicants:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Dongwoo Fine-chem Co., Ltd., Iksan, Jeonrabuk-Do, KR;

Inventors:

Jong-Hyun Choung, Yongin, KR;

In-Bae Kim, Yongin, KR;

Jae-Woo Jeong, Yongin, KR;

Hong-Sick Park, Yongin, KR;

In-Seol Kuk, Iksan, KR;

Gi-Yong Nam, Iksan, KR;

Young-Chul Park, Iksan, KR;

In-Ho Yu, Iksan, KR;

Young-Jin Yoon, Iksan, KR;

Suck-Jun Lee, Iksan, KR;

Assignees:

SAMSUNG DISPLAY CO., LTD., , KR;

DONGWOO FINE-CHEM CO., LTD., , KR;

Attorney:

Cantor Colburn LLP

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 29/66 (2006.01); C09K 13/08 (2006.01); H01L 21/3213 (2006.01); C23F 1/02 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66742 (2013.01); C09K 13/08 (2013.01); C23F 1/02 (2013.01); C23F 1/18 (2013.01); C23F 1/26 (2013.01); H01L 21/32134 (2013.01); H01L 29/458 (2013.01); H01L 29/4908 (2013.01); H01L 27/3276 (2013.01);
Abstract

An etchant composition includes about 0.5 weight % to about 20 weight % of persulfate, about 0.01 weight % to about 2 weight % of a fluoride compound, about 1 weight % to about 10 weight % of an inorganic acid, about 0.5 weight % to about 5 weight % of a cyclic amine compound, about 0.1 weight % to about 10.0 weight % of a compound having an amino group and a sulfonic acid, about 0.1 weight % to about 15.0 weight % of an organic acid or a salt thereof, and water to 100 weight % of the etchant composition.

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