The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Aug. 19, 2009
Applicant:
Hongmei Liao, San Diego, CA (US);
Inventor:
Hongmei Liao, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/522 (2013.01); H01L 2924/0002 (2013.01);
Abstract
In one embodiment, an integrated circuit has a conductive layer, where the conductive layer has a first set of regions and a second set of fill material regions, and the second set of fill material regions has a line of symmetry. Other embodiments are described and claimed.
Liao, Hongmei. (2016). Adding symmetrical filling material in an integrated circuit layout (U.S. Patent No. 9293408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9293408
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile