The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Mar. 19, 2014
Applicants:
Wai Keong Wong, Shah Alam, MY;
Soo Choong Chee, Shah Alam, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Inventors:
Wai Keong Wong, Shah Alam, MY;
Soo Choong Chee, Shah Alam, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 24/49 (2013.01); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/49551 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
A lead frame for a semiconductor device includes a die paddle and leads situated on a perimeter of the lead frame. The die paddle has a metal frame and a number of substantially linear metal connecting bars within the frame. The connecting bars interconnect different locations of the frame to form a multiple triangles, where a triangular-shaped cavity is formed within each triangle. An overall area of the cavities is greater than an overall area of the connecting bars.