The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Sep. 12, 2012
Applicant:

Benjamin W. Mooring, Cedar Park, TX (US);

Inventor:

Benjamin W. Mooring, Cedar Park, TX (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/00 (2013.01); H01L 21/67161 (2013.01); H01L 21/67196 (2013.01); H01L 21/67207 (2013.01); H01L 21/67742 (2013.01);
Abstract

Semiconductor processing equipment. At least some of the illustrative embodiments are systems including: a front end robot configured to pull individual wafers from at least one wafer carrier; a linear robot in operational relationship to the front end robot, the linear robot configured to move wafers along an extended length path; and a first processing cluster in operational relationship to the linear robot. The first processing cluster may include: a first processing chamber; a second processing chamber; and a first cluster robot disposed between the first and second processing chambers. The first cluster robot is configured to transfer wafers from the linear robot to the processing chambers, and configured to transfer wafers from the processing chambers to the linear robot.


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