The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Dec. 17, 2013
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventor:
Alan Hiroshi Ouye, San Mateo, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01J 37/32 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32798 (2013.01); H01J 37/32477 (2013.01); H01J 37/32522 (2013.01); H01J 37/32642 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01);
Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma thermal shield for a plasma processing chamber includes an annular ring body having an inner opening. A plasma-facing surface of the annular ring body has a general topography. A bottom surface of the annular ring body reciprocates the general topography with recessed regions disposed therein, providing one or more protruding regions at the bottom surface of the annular ring body.