The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Mar. 20, 2012
Liangheng Xu, Shanghai, CN;
Kai Yang, Shanghai, CN;
Yun Gao, Shanghai, CN;
Jin Tao, Shanghai, CN;
Xiaodong He, Shanghai, CN;
Liangheng Xu, Shanghai, CN;
Kai Yang, Shanghai, CN;
Yun Gao, Shanghai, CN;
Jin Tao, Shanghai, CN;
Xiaodong He, Shanghai, CN;
SHANGHAI TECHSUN ANTICOUNTERFEITING TECHNOLOGY HOL, Shanghai, CN;
SHANGHAI TECHSUN RFID TECHNOLOGY CO., LTD., Shanghai, CN;
Abstract
The present invention provides a radio frequency identification electronic tag with diversion-proof function and a process for making the same. The radio frequency identification electronic tag with diversion-proof function is formed of a supporting layer, a release liner, an antenna and a chip, wherein the release liner is bonded to one side of the supporting layer to form an entity, the antenna is bonded to the other side of the release liner, or, the antenna is bonded to the two sides of the entity formed by the supporting layer and the release liner, and is connected via overbridge points on the antenna, the overbridge points run through the supporting layer and the release liner so that antennas at the two sides are switched into conduction; the chip is bonded to the antenna. Once the RFID tag with diversion-proof function is peeled off or transferred, its physical structure will be destroyed and the information contained therein cannot be read, achieving the object of incapable of being reused. At the same time, the thermosetting resins are bonded organically according to the processing technology of the RFID tag, then the bonding points and the overbridge points of the chip have higher bonding fastness with the supporting layer, it is not easy for the chip to peel off with the release liner and better overbridge effect is achieved, which can greatly improve the yield of the finished RFID tag with diversion-proof function.