The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Jun. 05, 2013
Applicant:

Invensense, Inc., Sunnyvale, CA (US);

Inventors:

Steven S. Nasiri, Saratoga, CA (US);

David Sachs, New York, NY (US);

Assignee:

INVENSENSE, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/03 (2006.01); A63F 13/20 (2014.01); G03B 17/00 (2006.01); G06F 1/16 (2006.01); G06F 3/01 (2006.01); G06F 3/0346 (2013.01); G06F 3/0485 (2013.01); H04M 1/725 (2006.01);
U.S. Cl.
CPC ...
G06F 3/03 (2013.01); A63F 13/06 (2013.01); G03B 17/00 (2013.01); G06F 1/1626 (2013.01); G06F 1/1694 (2013.01); G06F 3/017 (2013.01); G06F 3/0346 (2013.01); G06F 3/0485 (2013.01); A63F 2300/105 (2013.01); A63F 2300/204 (2013.01); A63F 2300/6676 (2013.01); G06F 2200/1614 (2013.01); G06F 2200/1637 (2013.01); G06F 2203/04806 (2013.01); H04M 1/72583 (2013.01); H04M 2250/12 (2013.01);
Abstract

Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.


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