The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Mar. 13, 2013
Applicant:

Elwha Llc, Bellevue, WA (US);

Inventors:

Philip Lionel Barnes, Seattle, WA (US);

Hon Wah Chin, Palo Alto, CA (US);

Howard Lee Davidson, San Carlos, CA (US);

Kimberly D. A. Hallman, Bellevue, WA (US);

Roderick A. Hyde, Redmond, WA (US);

Muriel Y. Ishikawa, Livermore, CA (US);

Jordin T. Kare, Seattle, WA (US);

Brian Lee, Redmond, WA (US);

Richard T. Lord, Tacoma, WA (US);

Robert W. Lord, Seattle, WA (US);

Craig J. Mundie, Seattle, WA (US);

Nathan P. Myhrvold, Medina, WA (US);

Nicholas F. Pasch, Bellevue, WA (US);

Eric D. Rudder, Mercer Island, WA (US);

Clarence T. Tegreene, Mercer Island, WA (US);

Marc Tremblay, Clyde Hill, WA (US);

David B. Tuckerman, Lafayette, CA (US);

Charles Whitmer, North Bend, WA (US);

Lowell L. Wood, Jr., Bellevue, WA (US);

Assignee:

Elwha LLC, Bellevue, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/06 (2006.01); G06F 1/20 (2006.01); H04M 1/725 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
F28D 15/06 (2013.01); G06F 1/203 (2013.01); G06F 1/206 (2013.01); H04M 1/725 (2013.01); H01L 23/34 (2013.01); H01L 2924/0002 (2013.01); H04M 2250/12 (2013.01);
Abstract

Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes a proximity sensor configured to determine a location of a user touch to the shell relative to the location of the heat-rejection element. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the determined location of the user touch relative to the location of the heat-rejection element.


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