The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Dec. 20, 2013
Applicants:

Kuo Hsun Chen, Toufen Town, Miaoli County, TW;

Hsun Ching Chiang, Hsinchu, TW;

Yi an Sha, New Taipei, TW;

Hsiang Yun Yang, Hsin-Chu Hsien, TW;

Inventors:

Kuo Hsun Chen, Toufen Town, Miaoli County, TW;

Hsun Ching Chiang, Hsinchu, TW;

Yi An Sha, New Taipei, TW;

Hsiang Yun Yang, Hsin-Chu Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2015.01); F21K 99/00 (2010.01); F21V 29/87 (2015.01); F21Y 101/02 (2006.01); F21Y 111/00 (2006.01);
U.S. Cl.
CPC ...
F21K 9/1355 (2013.01); F21V 29/87 (2015.01); F21Y 2101/02 (2013.01); F21Y 2111/005 (2013.01);
Abstract

An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm, and the insulating adhesive layer can withstand a voltage of at least 500 volts.


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