The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Jun. 29, 2011
Applicants:

Kouichi Banno, Nagoya, JP;

Toshiyuki Hyoudo, Nagoya, JP;

Tadashi Nishida, Nagoya, JP;

Hideto Terada, Nagoya, JP;

Inventors:

Kouichi Banno, Nagoya, JP;

Toshiyuki Hyoudo, Nagoya, JP;

Tadashi Nishida, Nagoya, JP;

Hideto Terada, Nagoya, JP;

Assignees:

SINTOKOGIO, LTD., Nagoya-Shi, JP;

FUJIWA DENKI CO., LTD., Nagoya-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 39/04 (2006.01); B22D 37/00 (2006.01);
U.S. Cl.
CPC ...
B22D 39/04 (2013.01); B22D 37/00 (2013.01);
Abstract

The present invention provides pouring equipment of a tilting-type that can appropriately pour molten metal at a high speed corresponding to the speed of molding. It also provides a method of pouring the molten metal. The pouring equipment has a holding furnace supplying the molten metal by being tilted, a pouring ladle pouring the molten metal supplied from the holding furnace into molds that are intermittently transported, a device for measuring weight of the molten metal in the pouring ladle, and equipment for control that controls the tiltings of the holding furnace and the pouring ladle. The equipment for control has a device for storing results from measurements and devices for calculating the first and second flow rate. The equipment controls the tilting of the ladle so that the ladle pours the molten metal into the mold according to the flow pattern of the product.


Find Patent Forward Citations

Loading…