The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Jun. 30, 2014
Applicants:

Hiroshi Miura, Miyagi, JP;

Koei Suzuki, Kanagawa, JP;

Atsushi Onodera, Kanagawa, JP;

Takanori Tano, Chiba, JP;

Inventors:

Hiroshi Miura, Miyagi, JP;

Koei Suzuki, Kanagawa, JP;

Atsushi Onodera, Kanagawa, JP;

Takanori Tano, Chiba, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/00 (2006.01); H05K 3/12 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1258 (2013.01); H05K 3/1208 (2013.01); H05K 1/0306 (2013.01); H05K 1/097 (2013.01); H05K 3/0026 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/108 (2013.01); H05K 2203/1173 (2013.01);
Abstract

A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.


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