The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Dec. 04, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Eun Sil Kim, Suwon, KR;
Sung Han Kim, Suwon, KR;
Sa Yong Lee, Suwon, KR;
Jin Ho Hong, Suwon, KR;
Yong Il Kwon, Suwon, KR;
Sang Hyun Shin, Suwon, KR;
Keun Yong Lee, Suwon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); G03F 7/40 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); G03F 7/40 (2013.01); H05K 3/107 (2013.01); H05K 3/1258 (2013.01); H05K 1/0274 (2013.01); H05K 1/0393 (2013.01); H05K 3/4061 (2013.01); H05K 3/426 (2013.01); H05K 2201/0376 (2013.01);
Abstract
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.