The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Mar. 18, 2013
Applicant:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Inventors:

Jian-Hong Zeng, Taoyuan Hsien, CN;

Shou-Yu Hong, Taoyuan Hsien, CN;

Xue-Tao Guo, Taoyuan Hsien, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H03L 5/00 (2006.01); H02M 1/14 (2006.01); H01L 25/00 (2006.01); H02M 7/00 (2006.01); H05K 7/14 (2006.01); H01L 23/00 (2006.01); H05K 5/06 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01); H02M 7/5388 (2007.01);
U.S. Cl.
CPC ...
H02M 1/143 (2013.01); H01L 24/49 (2013.01); H01L 25/50 (2013.01); H02M 7/003 (2013.01); H05K 5/064 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H02M 7/5388 (2013.01);
Abstract

A power system, a power module therein and a method for fabricating power module are disclosed herein. The power module includes a first and a second common pins, and a first and a second bridge arms. The first and the second common pins are symmetrically disposed at one side of a substrate. The first bridge arm includes a first and a second semiconductor devices, and the first and the second semiconductor devices are connected to each other through the first common pin and disposed adjacently. The second bridge arm includes a third and a fourth semiconductor devices, and the third and the fourth semiconductor devices are connected to each other through the second common pin and disposed adjacently. The first and the third semiconductor devices are disposed symmetrically, and the second and the fourth semiconductor devices are disposed symmetrically.


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