The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Mar. 09, 2012
Applicants:

Judson Sloan Marte, Wynantskill, NY (US);

Xianrui Huang, Clifton Park, NY (US);

Evangelos Trifon Laskaris, Schenectady, NY (US);

Bruce Alan Knudsen, Amsterdam, NY (US);

Thomas Robert Raber, Schenectady, NY (US);

Robert John Zabala, Schenectady, NY (US);

James William Bray, Niskayuna, NY (US);

Paul Shadforth Thompson, Stephentown, NY (US);

Sergio Paulo Martins Loureiro, Saratoga Springs, NY (US);

Curtis Alan Johnson, Niskayuna, NY (US);

Sylvia Marie Decarr, Schenectady, NY (US);

Inventors:

Judson Sloan Marte, Wynantskill, NY (US);

Xianrui Huang, Clifton Park, NY (US);

Evangelos Trifon Laskaris, Schenectady, NY (US);

Bruce Alan Knudsen, Amsterdam, NY (US);

Thomas Robert Raber, Schenectady, NY (US);

Robert John Zabala, Schenectady, NY (US);

James William Bray, Niskayuna, NY (US);

Paul Shadforth Thompson, Stephentown, NY (US);

Sergio Paulo Martins Loureiro, Saratoga Springs, NY (US);

Curtis Alan Johnson, Niskayuna, NY (US);

Sylvia Marie Decarr, Schenectady, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01L 39/02 (2006.01); H01R 4/68 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
H01L 39/02 (2013.01); H01R 4/68 (2013.01); H01R 13/03 (2013.01); Y10T 29/49014 (2015.01); Y10T 29/49194 (2015.01);
Abstract

Method for joining wires using low resistivity joints is provided. More specifically, methods of joining one or more wires having superconductive filaments, such as magnesium diboride filaments, are provided. The wires are joined by a low resistivity joint to form wires of a desired length for applications, such in medical imaging applications.


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