The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
May. 08, 2014
Applicant:
Tsmc Solid State Lighting Ltd., Hsinchu, TW;
Inventors:
Chyi Shyuan Chern, Taipei, TW;
Hsin-Hsien Wu, Hsinchu, TW;
Chih-Kuang Yu, Chiayi, TW;
Hung-Yi Kuo, Taipei, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/603 (2006.01); H01L 33/62 (2010.01); H01L 23/495 (2006.01); H01L 33/00 (2010.01); H01L 33/08 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 23/49513 (2013.01); H01L 33/0095 (2013.01); H01L 33/08 (2013.01); H01L 25/0753 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A plurality of conductive pads are disposed on a substrate. A plurality of semiconductor dies are each disposed on a respective one of the conductive pads. A mold device is positioned over the substrate. The mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath.