The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9287477 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 15, 2016

Filed:

Feb. 02, 2012
Applicants:

Jae Jin Lee, Ansan-si, KR;

Sung Ho Choi, Ansan-si, KR;

Duk IN Kang, Ansan-si, KR;

Inventors:

Jae Jin Lee, Ansan-si, KR;

Sung Ho Choi, Ansan-si, KR;

Duk In Kang, Ansan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 51/50 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 27/32 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 51/50 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

An LED package includes a lead frame, a housing part, and a lead heat dissipating part. The lead frame includes a first lead mounting an LED chip and a second lead spaced apart from the first lead. The housing part covers a portion of the lead frame and includes an opening part for exposing the LED chip, a first side corresponding to a support side contacting the first lead and the second lead, and a second side opposite to the first side. The lead heat dissipating part is extended from the first lead and exposed partially to the first side of the housing part. Herein, the first side of the housing part is thicker than the second side.


Find Patent Forward Citations

Lee, Jae. (2016). Light emitting diode package (U.S. Patent No. 9287477). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9287477

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