The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Nov. 29, 2012
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 27/108 (2006.01); H01L 43/12 (2006.01); H01L 29/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 27/10852 (2013.01); H01L 28/91 (2013.01);
Abstract
According to example embodiments of inventive concepts, method of forming a semiconductor memory devices includes sequentially forming a first mold layer, a first support layer, a second mold layer, and a second support layer on a substrate, forming lower electrodes penetrating the second support layer, the second mold layer, the first support layer, and the first mold layer on the substrate, patterning the second support layer to form a second support pattern including an opening, removing the second mold layer to expose portions of sidewalls of the lower electrodes, and etching the exposed sidewalls of the lower electrodes.