The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Aug. 23, 2011
Applicants:

Johnny Kin on Sin, Hong Kong, CN;

Rongxiang Wu, Hong Kong, CN;

Ron Shu Yuen Hui, Hong Kong, CN;

Inventors:

Johnny Kin On Sin, Hong Kong, CN;

Rongxiang Wu, Hong Kong, CN;

Ron Shu Yuen Hui, Hong Kong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 27/04 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 27/28 (2013.01); H01L 23/645 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Providing for a monolithic magnetic induction device having low DC resistance and small surface area is described herein. By way of example, the magnetic induction device can comprise a substrate (e.g., a semiconductor substrate) having trenches formed in a bottom layer of the substrate, and holes formed in the substrate between the trenches and an upper layer of the substrate. Additionally, the magnetic induction device can comprise a conductive coil embedded or deposited within the trenches. The magnetic induction device can further comprise a set of conductive vias formed in the holes that electrically connect the bottom layer of the substrate with the upper layer. Further, one or more integrated circuit components, such as active devices, can be formed in the upper layer, at least in part above the conductive coil. The vias can be utilized to connect to integrated circuit components with the conductive coil, where suitable.


Find Patent Forward Citations

Loading…