The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Jan. 14, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Ji Bum Cha, Gyunggi-do, KR;

Sung Jae Lee, Gyunggi-do, KR;

In Cheol Chang, Gyunggi-do, KR;

Sung Jun Byun, Gyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14685 (2013.01); H01L 24/83 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14683 (2013.01); H04N 5/2257 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83856 (2013.01); H01L 2924/3511 (2013.01);
Abstract

There is provided an image sensor module, including: an image sensor having a small thickness of 175 μm or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.


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