The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Mar. 12, 2013
Applicant:

Panasonic Corporation, Kadoma-shi, Osaka, JP;

Inventors:

Tomohiro Kinoshita, Hyogo, JP;

Eiji Takahashi, Nara, JP;

Naoki Komatsu, Osaka, JP;

Kazuhide Uriu, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H04N 21/426 (2011.01); H04N 5/775 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/49 (2013.01); H01L 25/0657 (2013.01); H04N 21/42607 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49051 (2013.01); H01L 2224/49097 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H04N 5/775 (2013.01);
Abstract

A semiconductor device comprises a first semiconductor chip; and a second semiconductor chip provided on the first semiconductor chip with having chip-on-chip connection to the first semiconductor chip, wherein when seen from a direction perpendicular to an upper surface of the second semiconductor chip, an outline of the second semiconductor chip is larger than an outline of the first semiconductor chip, a plurality of electrode terminals for the first semiconductor chip are provided on an upper surface of the first semiconductor chip, the plurality of electrode terminals for the first semiconductor chip comprise one or more first covered terminals which are covered with the second semiconductor chip and one or more first uncovered terminals which are not covered with the second semiconductor chip.


Find Patent Forward Citations

Loading…