The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Nov. 11, 2014
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Weimin Sun, Santa Rosa Valley, CA (US);

Peter J. Zampardi, Jr., Newbury Park, CA (US);

Hongxiao Shao, Thousand Oaks, CA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/80 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 23/4952 (2013.01); H01L 23/642 (2013.01); H01L 23/66 (2013.01); H01L 24/03 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 23/49838 (2013.01); H01L 2223/6605 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/095 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/30101 (2013.01);
Abstract

To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.


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