The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Jun. 26, 2014
Baek Soung Park, Uiwang-si, KR;
Jae Won Choi, Uiwang-si, KR;
Sung Min Kim, Uiwang-si, KR;
IN Hwan Kim, Uiwang-si, KR;
Jun Woo Lee, Uiwang-si, KR;
Su ML Im, Uiwang-si, KR;
Baek Soung Park, Uiwang-si, KR;
Jae Won Choi, Uiwang-si, KR;
Sung Min Kim, Uiwang-si, KR;
In Hwan Kim, Uiwang-si, KR;
Jun Woo Lee, Uiwang-si, KR;
Su Ml Im, Uiwang-si, KR;
CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;
Abstract
A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.