The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

May. 08, 2015
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Norimune Orimoto, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/31 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3107 (2013.01); H01L 23/3733 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/473 (2013.01); H01L 25/0655 (2013.01);
Abstract

A semiconductor deviceincludes a thermal radiation member; a first semiconductor chipconnected to the thermal radiation member; a second semiconductor chipconnected to the thermal radiation member; and sealing resinsealing the first semiconductor chipand the second semiconductor chip. The semiconductor devicecomprises a first thermal diffusion memberconnected to the thermal radiation member; a second thermal diffusion memberconnected to the thermal radiation member; and a coolerconfigured to cool the first thermal diffusion memberand the second thermal diffusion member. A space between the first thermal diffusion memberand the second thermal diffusion memberis positioned to oppose a space between the first semiconductor chipand the second semiconductor chipvia the thermal radiation member


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