The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Apr. 16, 2013
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Nobuyuki Kondo, Taketoyo, JP;
Morimichi Watanabe, Nagoya, JP;
Asumi Jindo, Okazaki, JP;
Yuji Katsuda, Tsushima, JP;
Yosuke Sato, Hashima-County, JP;
Yoshinori Isoda, Nagoya, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/02 (2006.01); H01L 21/67 (2006.01); C04B 35/581 (2006.01); H05B 1/00 (2006.01); B32B 18/00 (2006.01); H05B 3/28 (2006.01); H01L 21/683 (2006.01); C04B 35/58 (2006.01); C04B 35/626 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67 (2013.01); B32B 18/00 (2013.01); C04B 35/58 (2013.01); C04B 35/581 (2013.01); C04B 35/6261 (2013.01); C04B 35/62655 (2013.01); C04B 35/645 (2013.01); C04B 37/001 (2013.01); C04B 37/003 (2013.01); C23C 14/3414 (2013.01); H01L 21/6831 (2013.01); H05B 1/00 (2013.01); H05B 3/283 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3865 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/08 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/366 (2013.01); C04B 2237/58 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); Y10T 428/24942 (2015.01);
Abstract
A heating apparatusA includes a susceptor partA having a heating faceof heating a semiconductor W, and a ring shaped partA provided in the outside of the heating face. The ring shaped partA is composed of a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The ceramic material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° taken by using CuKα ray.