The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Jan. 09, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;

Inventors:

Hae Sock Chung, Gyunggi-do, KR;

Byoung Hwa Lee, Gyunggi-do, KR;

Eun Hyuk Chae, Gyunggi-do, KR;

Min Cheol Park, Gyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness tand tof the first and second internal electrodes is 0.9 μm or less, while a roughness Rof the first internal electrode is lower than a roughness Rof the second internal electrode.


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