The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Apr. 11, 2011
Applicants:

Lesheng Chen, Yueqing, CN;

Xiao Chen, Yueqing, CN;

Gengxin Qi, Yueqing, CN;

Chengfa Mu, Yueqing, CN;

Inventors:

Lesheng Chen, Yueqing, CN;

Xiao Chen, Yueqing, CN;

Gengxin Qi, Yueqing, CN;

Chengfa Mu, Yueqing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C23C 30/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); C23C 30/00 (2013.01);
Abstract

A method for preparing silver-based electrical contact materials with fiber-like arrangement of reinforcing nanoparticles includes (1) uniformly mixing reinforcement powders and silver matrix powders for ball milling; (2) pouring the obtained composite powders and silver matrix powders into a powder mixing machine for powder mixing; (3) cold isostatic pressing; (4) sintering; (5) hot pressing; and (6) hot extruding to obtain silver-based electrical contact materials with fiber-like arrangement of reinforcing nanoparticles. The method of the present invention can obtain silver-based electrical contact materials with fiber-like arrangement of reinforcing nanoparticles with no specific requirement on processing deformation, and the plasticity and ductility of the reinforcing phase. Furthermore, it has simple processes, low cost and no particular requirements on the equipment. Contact materials prepared by the present method have good resistance to welding and arc erosion, conductivity and a greatly enhanced processing performance.


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