The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Feb. 26, 2015
Applicant:

Sii Printek Inc., Chiba-shi, Chiba, JP;

Inventor:

Satoshi Horiguchi, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/14209 (2013.01); B41J 2/1607 (2013.01); B41J 2/1609 (2013.01); B41J 2/1623 (2013.01); B41J 2/1632 (2013.01); B41J 2/1634 (2013.01); B41J 2/1643 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A method of manufacturing a liquid jet head includes: a groove forming step of alternately forming ejection grooves and non-ejection grooves in a reference direction on an upper surface of an actuator substrate; a cover plate processing step of forming a recessed portion on an upper surface of a cover plate and slits penetrating the cover plate from a bottom surface of the recessed portion through a lower surface located opposite to the upper surface of the cover plate; a substrate bonding step of bonding the lower surface of the cover plate to the upper surface of the actuator substrate to allow the slits to communicate with the respective ejection grooves; and an electrode forming step of simultaneously forming conductive films on side surfaces of the ejection grooves, side surfaces of the non-ejection grooves, and inner surfaces of the slits and the recessed portion.


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