The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

May. 27, 2015
Applicant:

Enplas Corporation, Saitama, JP;

Inventors:

Koichi Ono, Saitama, JP;

Ken Kitamoto, Saitama, JP;

Assignee:

Enplas Corporation, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 15/06 (2006.01); G01N 33/00 (2006.01); G01N 33/48 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/50273 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/14 (2013.01);
Abstract

A fluid handling device includes a substrate, a film, and a conductive layer. The substrate includes a first through-hole, and a second through-hole. The conductive layer is disposed on one surface of the film to extend in a first area, a second area and a third area of the film. The substrate includes a first surface and a second surface facing away from the first surface. The first area is bonded to the first surface of the substrate such that a housing part is formed by closing one opening of the first through-hole, and such that a part of the conductive layer is exposed to the inside of the housing part. The second area is disposed inside the second through-hole, and the third area is bonded to the second surface of the substrate such that a part of the conductive layer is exposed to the outside.


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