The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Jul. 24, 2013
Applicant:

Zycube Co., Ltd., Kanagawa, JP;

Inventors:

Manabu Bonkohara, Kanagawa, JP;

Hirofumi Nakamura, Kanagawa, JP;

Qiwei He, Kanagawa, JP;

Assignee:

ZYCUBE CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/00 (2006.01); H01L 21/768 (2006.01); H01L 23/482 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01L 21/76855 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/4828 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/53257 (2013.01); H05K 3/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of forming a low-resistance, high-reliability through/embedded electrode is provided, where the electrode can be arranged in a higher density according to the miniaturization of the semiconductor manufacturing technology. This method includes the step of filling an openingof a substratewith a pasteof a first conductive material and drying the paste; the step of solid-phase sintering the pastefilled in the opening, generating a first porous conductor; the step of applying a paste of a second conductive material so as to cover the first conductor; and the step of melting the paste of the second conductive material by heat treatment, impregnating the second conductive material into the first conductor


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