The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jun. 05, 2013
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventor:
Satoshi Shirahama, Yokohama, JP;
Assignee:
Nichia Corporation, Anan-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/00 (2006.01); H01L 33/52 (2010.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 23/4952 (2013.01); H01L 24/45 (2013.01); H01L 33/62 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48475 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49429 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01);
Abstract
Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.