The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Apr. 28, 2015
Applicant:
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventor:
Chih-Chen Lai, New Taipei, TW;
Assignee:
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01);
Abstract
A method for manufacturing an LED die includes following steps: a semi-finished LED die is provided; an N-type layer, an active layer, and an P-type layer are sequentially formed on the transparent substrate; the transparent substrate is etched by laser to form a light outputting surface, the light outputting surface having a smoothly concave and arc-shaped configuration; common parts of the active layer and the P-type layer are removed to expose a part of the N-type layer; and an electrode structure is disposed on exposed N-type layer and the p-type layer to complete the formation of the LED die.