The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9281364 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 08, 2016

Filed:

May. 27, 2014
Applicants:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Denso Corporation, Kariya-shi, Aichi-ken, JP;

Inventors:

Hisashi Ishimabushi, Toyota, JP;

Tomohiro Mimura, Nisshin, JP;

Narumasa Soejima, Seto, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 21/336 (2006.01); H01L 29/16 (2006.01); H01L 21/04 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01); H01L 29/861 (2006.01); H01L 29/06 (2006.01); H01L 29/786 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/046 (2013.01); H01L 21/0465 (2013.01); H01L 21/0495 (2013.01); H01L 29/0619 (2013.01); H01L 29/6606 (2013.01); H01L 29/861 (2013.01); H01L 29/872 (2013.01); H01L 29/7802 (2013.01); H01L 29/78642 (2013.01);
Abstract

In a semiconductor substrate preparation step, a semiconductor substrate which is made of SiC and in which a first semiconductor region of a first conductivity type is formed is prepared. In a second semiconductor region forming step, a second semiconductor region is formed by implanting an impurity of a second conductivity type into a first semiconductor region through multiple ion implantation steps while varying implantation depths of the respective multiple ion implantation steps. In the second semiconductor region forming step, a dose amount of the impurity when an implantation energy of multiple ion implantation steps is the largest is smaller than a dose amount of impurity when the implantation energy is not the largest.


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