The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Sep. 17, 2014
Applicant:
Sunasic Technologies, Inc., New Taipei, TW;
Inventors:
Chi-Chou Lin, New Taipei, TW;
Zheng-Ping He, New Taipei, TW;
Assignee:
Sunasic Technologies, Inc., New Taipei, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); H01L 27/146 (2013.01); H01L 21/4857 (2013.01); H01L 23/5389 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/484 (2013.01);
Abstract
A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.